ABL HEATSINKS BGA-STD-010 Heat Sink, For Ball Grid Array, Standard, BGA, 27 °C/W, 10 mm, 13.5 mm, 13 mm Hosa Technology BNC-58-101 It's a reliable and convenient

It's a reliable and convenient solution for connecting devices to USB ports that are too close to one another (e

Designed for Projectors

Fits Flat Screen Monitors up to 45"

Does not corrode copper or its alloys

ILOAD = 10mA

ABL HEATSINKS BGA-STD-010 Heat Sink, For Ball Grid Array, Standard, BGA, 27 °C/W, 10 mm, 13.5 mm, 13 mm Hosa Technology BNC-58-101 It's a reliable and convenientThe BGA STD 010 is a 13mm standard Heat Sink with aluminium, black anodized, thermal tape, 27C W thermal resistance. This heat sink features excellent thermal conductivity, cushioning and gap filling properties, the pad is an ideal thermal interface material specifically designed for heat sink attachment to MPU, chip set and other plastic encapsulated components. It consists of an aluminium foil backing coated, on both sides with a very high